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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
11/26/2002
Application #:
09524324
Filing Dt:
03/13/2000
Publication #:
Pub Dt:
09/26/2002
Inventors:
Kenneth J. Kledzik, Jason C. Engle
Title:
ELECTRONIC MODULE HAVING A THREE DIMENSIONAL ARRAY OF INTEGRATED CIRCUIT PACKAGES
Assignment: 1
Reel/Frame:
010619/0185Recorded: 03/13/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/02/1999
Exec Dt:
04/02/1999
Assignee:
1001 CALLE AMANECER
SAN CLEMENTE, CALIFORNIA 92673
Correspondent:
ANGUS C. FOX III
4093 N. IMPERIAL WAY
PROVO, UT 84604-6303
Assignment: 2
Reel/Frame:
029215/0894Recorded: 10/31/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/03/2011
Assignee:
300 NORTH DAKOTA AVENUE
SUITE 314
SIOUX FALLS, SOUTH DAKOTA 57104
Correspondent:
WOODS, FULLER, SHULTZ & SMITH, P.C.
P. O. BOX 5027
SIOUX FALLS, SD 57117-5027
Assignment: 3
Reel/Frame:
033430/0982Recorded: 07/29/2014Pages: 18
Conveyance:
SECURITY INTEREST
Assignor:
Exec Dt:
07/15/2014
Assignee:
400 SKOKIE BLVD. SUITE 375
NORTHBROOK, ILLINOIS 60062
Correspondent:
ANDREW M. SACHS, ESQ.
180 N. LA SALLE ST. SUITE 3300
CHICAGO, IL 60601

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