Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/03/2002
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Application #:
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09788465
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Filing Dt:
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02/21/2001
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Publication #:
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Pub Dt:
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09/06/2001
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Inventors:
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Akira Nagai, Masayuki Noda
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Title:
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RESIN COMPOUND, AND ADHESIVE FILM, METAL-CLAD ADHESIVE FILM, CIRCUIT BOARD, AND ASSEMBLY STRUCTURE, USING THE RESIN COMPOUND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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8-7, NIHONBASHI HON-CHO 2-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
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ANTONELLI, TERRY, STOUT & KRAUS, LLP |
WILLIAM I. SOLOMON |
1300 NORTH SEVENTEENTH STREET |
SUITE 1800 |
ARLINGTON, VA 22209 |
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