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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/17/2002
Application #:
09234937
Filing Dt:
01/21/1999
Inventors:
MICHIHIKO YANAGISAWA, SHINYA IIDA, YASUHIRO HORIIKE
Title:
WAFER FLATTENING PROCESS AND STORAGE MEDIUM
Assignment: 1
Reel/Frame:
009819/0994Recorded: 03/16/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/01/1999
Exec Dt:
03/01/1999
Exec Dt:
03/01/1999
Assignees:
30-3, NISHIROKUGOU 4-CHOME,OHTA-KU,
TOKYO, JAPAN
2-12, HIGASHIFUSHIMI 3-CHOME, HOUYA-SHI
TOKYO, JAPAN
Correspondent:
WALL MARJAMA BILINSKI & BURR
STEPHEN P. BURR
101 SOUTH SALINA STREET, SUITE 400
SYRACUSE, NY 13202

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