Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/14/2003
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Application #:
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09887148
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Filing Dt:
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06/22/2001
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Inventors:
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Christy Mei-Chu Woo, Connie Pin-Chin Wang, Steve C. Avanzino
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Title:
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UTILIZATION OF ANNEALING ENHANCED OR REPAIRED SEED LAYER TO IMPROVE COPPER INTERCONNECT RELIABILITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE AMD PLACE P.O. BOX 3453 |
SUNNYVALE, CALIFORNIA 94088 |
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RENNER, OTTO, BOISSELLE & SKLAR, LLP |
JOSEPH J. CRIMALDI |
1621 EUCLID AVENUE |
KEITH BUILDING; 19TH FLOOR |
CLEVELAND, OHIO 44115 |
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