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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/14/2003
Application #:
09726746
Filing Dt:
11/30/2000
Publication #:
Pub Dt:
05/30/2002
Inventors:
Nan-Chun Huang, Yin-Jen Lin
Title:
DIRECT-DOWNSET FLIP-CHIP PACKAGE ASSEMBLY AND METHOD OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
011323/0518Recorded: 11/30/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/01/2000
Exec Dt:
11/01/2000
Assignee:
NO. 123, SEC. 3, DA FONG ROAD, TANTZU
TAICHUNG, TAIWAN R.O.C
Correspondent:
EDWARDS & ANGELL, LLP
PETER F. CORLESS
130 WATER STREET
BOSTON, MA 02109

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