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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/14/2003
Application #:
09974227
Filing Dt:
10/10/2001
Inventors:
Cheng-Chung Tsao, Tien-Ler Lin
Title:
INTEGRATED CIRCUIT MEMORY CHIP FOR USE IN SINGLE OR MULTI-CHIP PACKAGING
Assignment: 1
Reel/Frame:
012246/0834Recorded: 10/10/2001Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/27/2001
Exec Dt:
09/27/2001
Assignee:
2255 MARTIN AVENUE, SUITE E
SANTA CLARA, CALIFORNIA 95050
Correspondent:
GRAY CARY WARE & FREIDENRICH LLP
RONALD L. YIN
1755 EMBARCADERO ROAD
PALO ALTO, CA 94303-3340
Assignment: 2
Reel/Frame:
012246/0958Recorded: 10/10/2001Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/27/2001
Exec Dt:
09/27/2001
Assignee:
SUITE E
2255 MARTIN AVENUE,
SANTA CLARA,, CALIFORNIA 95050
Correspondent:
GRAY CARY ET AL
RONALD L. YIN
1755 EMBARCADERO ROAD
PALO ALTO, CA 94303-3340

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