Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/18/2003
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Application #:
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09806733
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Filing Dt:
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04/04/2001
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Inventors:
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Hiroo Shimizu, Katsuhiro Niwa, Masayuki Tanaka
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Title:
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EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| A CORPORATION OF JAPAN |
| 2-1 NIHONBASHI-MUROMACHI 2-CHOME |
| CHUO-KU, TOKYO 103-8666, JAPAN |
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| SCHNADER HARRISON SEGAL & LEWIS |
| AUSTIN R. MILLER |
| 1600 MARKET STREET, 36TH FLOOR |
| PHILADELPHIA, PA 19103 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 508, HIGASHISHINAGAWA 2, CHOME |
| SHINAGAWA-KU |
| TOKYO 140-0002, JAPAN |
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| PIPER RUDNICK LLP |
| T. DANIEL CHRISTENBURY |
| 1650 MARKET STREET |
| ONE LIBERTY PLACE, STE. 4900 |
| PHILADELPHIA, PA 19103 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S AD
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| 5-8, HIGASHISHINAGAWA 2-CHOME |
| SHINAGAWA-KU |
| TOKYO 140-0002, JAPAN |
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| PIPER RUDNICK LLP |
| T. DANIEL CHRISTENBURY |
| ONE LIBERTY PLACE, SUITE 4900 |
| 1650 MARKET STREET |
| PHILADELPHIA, PA 19103 |
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