Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/04/2003
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Application #:
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09849137
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Filing Dt:
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05/04/2001
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Publication #:
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Pub Dt:
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04/04/2002
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Inventors:
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Yi-Chuan Ding, Chang-Chi Lee, Kun-Hing Chen, Yung-I Yeh
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Title:
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THERMAL ENHANCED BALL GRID ARRAY PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NANTZE EXPORT PROCESSING ZONE |
26, CHIN 3RD. RD., 811, NANTZE |
KAOHSIUNG, TAIWAN R.O.C |
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J.C. PATENTS, INC. |
JIAWEI HUANG |
1340 REYNOLDS AVE., SUITE 114 |
IRVINE, CA 92614 |
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