Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/04/2003
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Application #:
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09473525
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Filing Dt:
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12/28/1999
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Inventors:
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MICHAEL D. BEER, WESLEY R. ERCK
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Title:
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COMPUTATION OF DIE-PER-WAFER CONSIDERING PRODUCTION TECHNOLOGY AND WAFER SIZE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1109 MCKAY DRIVE |
SAN JOSE, CALIFORNIA 95131 |
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WAGNER, MURABITO & HAO LLP |
JOHN P. WAGNER, JR. |
TWO NORTH MARKET STREET, THIRD FLOOR |
SAN JOSE, CA 95113 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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GROENEWOUDSEWEG 1 |
EINDHAVEN, NETHERLANDS 5621 BA |
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PHILIPS ELECTRONICS NORTH AMERICA CORPOR |
INTELLECTUAL PROPERTY & STANDARDS |
1000 WEST MAUDE AVENUE |
SUNNYVALE, CA 94085-2810 |
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