Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/25/2003
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Application #:
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09946999
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Filing Dt:
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09/05/2001
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Publication #:
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Pub Dt:
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09/26/2002
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Inventors:
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Chien-Ping Huang, Chi-Chuan Wu, Jui-Yu Chuang, Lien-Chi Chan
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Title:
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HEAT SINK WITH COLLAPSE STRUCTURE AND SEMICONDUCTOR PACKAGE WITH HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
TAICHUNG, TAIWAN R.O.C |
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EDWARDS & ANGELL, LLP |
PETER F. CORLESS |
P.O. BOX 9169 |
BOSTON, MA 02209 |
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