Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/13/2003
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Application #:
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09993749
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Filing Dt:
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11/06/2001
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Publication #:
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Pub Dt:
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05/08/2003
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Inventor:
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Brian Lee
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Title:
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A NEW CONSOLIDATION METHOD OF JUNCTION CONTACT ETCH FOR BELOW 150 NANOMETER DEEP TRENCH-BASED DRAM DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE BASED INDUSTRIAL PARK |
| 3F, NO. 19 LI HSIN RD. |
| HSIN-CHU, TAIWAN |
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| GEORGE O. SAILE |
| 20 MCINTOSH DRIVE |
| POUGHKEEPSIE, NEW YORK 12603 |
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