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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/27/2003
Application #:
09716431
Filing Dt:
11/21/2000
Inventor:
Hidetoshi Hagihara
Title:
DUMMY INTERCONNECTS FOR SUPPRESSING THERMALLY GENERATED STRESS CRACKS
Assignment: 1
Reel/Frame:
013478/0233Recorded: 11/21/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/02/2000
Assignee:
22-22, NAGAIKO-CHO, ABENO-KU
OSAKA, JAPAN 545-8522
Correspondent:
H. WARREN BURNAM, JR.
NIXON & VANDERHYE P.C.
1100 NORTH GLEBE ROAD
8TH FLOOR
ARLINGTON, VA 22201
Assignment: 2
Reel/Frame:
053754/0905Recorded: 09/11/2020Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/21/2020
Assignee:
1437 HANGDU BUILDING,NO. 1006,HUAFU ROAD, HUAHANG COMMUNITY,HUAQIANGBEI STREET, FUTIAN DISTRICT
SHENZHEN, CHINA
Correspondent:
CALVIN H CHAI
550 S. HOPE STREET, SUITE 2825
LOS ANGELES, CA 90071

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