Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/10/2003
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Application #:
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09724727
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Filing Dt:
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11/28/2000
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Inventors:
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Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen et al
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Title:
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LOCKING OF MOLD COMPOUND TO CONDUCTIVE SUBSTRATE PANELS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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| BEYER, WEAVER & THOMAS, LLP |
| PHILLIP P. LEE |
| P.O. BOX 778 |
| BERKELE, CA 94704-0778 |
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