Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/01/2003
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Application #:
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09693766
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Filing Dt:
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10/20/2000
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Inventors:
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Lawrence Robert Blumberg, Robert Maynard Japp, William John Rudik, John Frank Surowka
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Title:
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METHOD FOR REDUCING COFFICIENT OF THERMAL EXPANSION IN CHIP ATTACH PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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DRIGGS, LUCAS, BRUBAKER & HOGG CO., LPA |
PATRICK J. DAUGHERTY |
8383 MENTOR AVENUE |
MENTOR, OH 44060 |
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