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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6590269
Issue Dt:
07/08/2003
Application #:
10114201
Filing Dt:
04/01/2002
Inventors:
Jason Chuang, Allis Chen, Jachson Hsieh, Hsiu Wen Tu, Yung Sheng Chiu, Meng Ru Tsai et al
Title:
PACKAGE STRUCTURE FOR A PHOTOSENSITIVE CHIP
Assignment: 1
Reel/Frame:
012781/0920Recorded: 04/01/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHUANG, JASON
Exec Dt:
03/20/2002
CHEN, ALLIS
Exec Dt:
03/20/2002
HSIEH, JACHSON
Exec Dt:
03/20/2002
TU, HSIU WEN
Exec Dt:
03/20/2002
TSAI, MENG RU
Exec Dt:
03/20/2002
HO, MON NAN
Exec Dt:
03/20/2002
HUANG, FU YUNG
Exec Dt:
03/20/2002
CHIU, YUNG SHENG
Exec Dt:
03/20/2002
WU, JICHEN
Exec Dt:
03/20/2002
HSU, CHIH CHENG
Exec Dt:
03/20/2002
Assignee:
KINGPAK TECHNOLOGY INC.
NO. 84, TAIHO RD., CHUPEI
HSINCHU HSIEN, TAIWAN R.O.C
Correspondent:
PRO-TECHTOR INTERNATIONAL
KEITH KLINE
20775 NORADA COURT
SARATOGA, CA 95070-3018
Assignment: 2
Reel/Frame:
050715/0641Recorded: 10/15/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
KINGPAK TECHNOLOGY INC.
Exec Dt:
10/15/2019
Assignee:
KT IMAGING USA, LLC
106 E. SIXTH STREET SUITE 900
AUSTIN, TEXAS 78701
Correspondent:
HAO NI
8140 WALNUT HILL LANE
SUITE-500
DALLAS, TX 75231

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