Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/05/2003
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Application #:
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09948527
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Filing Dt:
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09/08/2001
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Publication #:
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Pub Dt:
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10/24/2002
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Inventor:
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Chi Chuan Wu
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Title:
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SEMICONDUCTOR PACKAGE WITH HEAT-DISSIPATING STRUCTURE AND METHOD OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TANTZU |
| NO. 123 SEC. 3 DA FONG ROAD |
| TAICHUNG, TAIWAN ROC |
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| DIKE, BRONSTEIN, ROBERTS & CUSHMAN ETAL |
| PETER F. CORLESS |
| EDWARDS & ANGELL, LLP |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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