Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/05/2003
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Application #:
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10101231
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Filing Dt:
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03/19/2002
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Inventors:
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James Wilson Rose, Thomas Bert Gorczyca, Christopher James Kapusta et al
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Title:
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METHOD FOR MAKING MULTICHIP MODULE SUBSTRATES BY ENCAPSULATING ELECTRICAL CONDUCTORS AND FILLING GAPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MARYLAND 20817 |
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| DUANE MORRIS LLP |
| WILLIAM H. MEISE |
| 100 COLLEGE ROAD WEST |
| SUITE 100 |
| PRINCETON, NJ 08540 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 8 |
| SCHENECTADY, NEW YORK 12303 |
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| DUANE MORRIS LLP |
| WILLIAM H. MEISE |
| 100 COLLEGE ROAD WEST, SUITE 100 |
| PRINCETON, NJ 08540 |
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