Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/12/2003
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Application #:
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09621134
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Filing Dt:
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07/20/2000
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Inventors:
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Toshihiro Miyake, Katsuaki Kojima, Hiroyasu Iwama
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Title:
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BONDING METHOD AND BONDING STRUCTURE OF THERMOPLASTIC RESIN MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KARIYA-CITY |
| 1-1, SHOWA-CHO |
| AICHI-PREF, JAPAN 448-8 |
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| LAW OFFICE OF DAVID G. POSZ |
| DAVID G. POSZ |
| 601 PENNSYLVANIA AVENUE, NW |
| SUITE 900, SOUTH BUILDING |
| WASHINGTON, D.C. 20004 |
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