Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/26/2003
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Application #:
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09854303
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Filing Dt:
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05/11/2001
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Publication #:
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Pub Dt:
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11/14/2002
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Inventors:
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Han-Ping Pu, Yu-Po Wang, Caesar Lin
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Title:
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CHIP-ON-CHIP BASED MULTI-CHIP MODULE WITH MOLDED UNDERFILL AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG ROAD |
TANTZU, TAIHUNG, TAIWAN R.O.C |
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EDWARDS & ANGELL, LLP |
PETER F. CORLESS |
P.O. BOX 9169 |
BOSTON, MA 02209 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS, PREVIOUSLY RECORDED AT REEL 011813 FRAME 0514.
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NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
TAICHUNG, TAIWAN R.O.C |
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DIKE, BRONSTEIN, ROBERTS, ET AL. |
PETER F. CORLESS |
P.O. BOX 9169 |
BOSTON, MA 02209 |
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