Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/02/2003
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Application #:
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10013897
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Filing Dt:
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12/07/2001
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Publication #:
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Pub Dt:
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06/12/2003
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Inventors:
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Haim Feigenbaum, Blake F. Woith, John Szalay, Terry Wang
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Title:
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DE-MOUNTABLE, SOLDERLESS IN-LINE LEAD MODULE PACKAGE WITH INTERFACE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAIL CODE 480-414-420, POST OFFICE BOX 5052 |
| TROY, MICHIGAN 48007 |
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| CHRISTIE, PARKER & HALE, LLP |
| WILLIAM P. CHRISTIE |
| P.O. BOX 7068 |
| PASADENA, CA 91109-7068 |
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