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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/09/2003
Application #:
10050363
Filing Dt:
01/16/2002
Inventors:
Jason Burnett, Michael C. Iannaccone, Toshitaka Tezuna
Title:
METHOD AND APPARATUS FOR SOLDER SPLICING AND GROUNDING COAXIAL CABLES
Assignment: 1
Reel/Frame:
012509/0334Recorded: 01/16/2002Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/14/2002
Exec Dt:
01/14/2002
Exec Dt:
01/14/2002
Assignee:
6801 HAGGERTY ROAD
CANTON, MICHIGAN 48187
Correspondent:
THOMAS N. YOUNG
3001 W. BIG BEAVER ROAD, SUITE 624
TROY, MI 48084-3107

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