Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/07/2003
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Application #:
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09738953
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Filing Dt:
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12/14/2000
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Inventors:
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Aik Seng Kang, Ah Lek Hu, Harry Kam Cheng Hong
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Title:
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ROTARY MECHANICAL BUFFING METHOD FOR DEFLASHING OF MOLDED INTEGRATED CIRCUIT PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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BEYER WEAVER & THOMAS, LLP |
PHILLIP P, LEE |
P.O. BOX 778 |
BERKELEY, CA 94704-0778 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL 011800 FRAME 0744. (ASSIGNMENT OF ASSIGNOR'S INTEREST)
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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BEYER WEAVER & THOMAS, LLP |
PHILLIP P. LEE |
P.O. BOX 778 |
BERKELEY, CA 94704-0778 |
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