Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/14/2003
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Application #:
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10241062
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Filing Dt:
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09/10/2002
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Publication #:
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Pub Dt:
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03/13/2003
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Inventors:
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James L. Cheever, Charles L. Goldsmith, John C. Ehmke, Billy D. Ables
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Title:
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WAFER LEVEL INTERCONNECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 141 SPRING STREET |
| LEXINGTON, MASSACHUSETTS 02421-7899 |
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| BAKER BOTTS L.L.P. |
| HAROLD E. MEIER |
| 2001 ROSS AVENUE, SUITE 600 |
| DALLAS, TX 75201-2980 |
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