Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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10/14/2003
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Application #:
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10162910
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Filing Dt:
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06/06/2002
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Inventors:
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Yi-Liang Peng, Kai-Chiang Wu
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Title:
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STACKED CHIP SCALE PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 9, LI-HSIN RD. V |
HSINCHU, TAIWAN |
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ROSENBERG, KLEIN & LEE |
MORTON J. ROSENBERG |
3458 ELLICOTT CENTER DRIVE |
SUITE 101 |
ELLICOTT CITY, MD 21043 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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UNIT A, 19/F, V GA BUILDING |
532 CASTLE PEAK ROAD, HONG KONG |
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ROSENBERG, KLEIN & LEE |
MORTON J. ROSENBERG |
3458 ELLICOTT CENTER DRIVE |
SUTIE 101 |
ELLICOTT CITY, MD 21043 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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34TH FLOOR, THE LEE GARDENS, 33 HYSAN AVENUE |
CAUSEWAY BAY, HONG KONG |
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CHENG-JU CHIANG |
P.O. BOX 766 |
CHINO, CA 91708 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 699 GUOSHOUJING ROAD, PUDONG NEW AREA |
SHANGHAI CITY, CHINA 201203 |
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CHENG-JU CHIANG |
P.O. BOX 766 |
CHINO, CA 91708 |
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