Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/21/2003
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Application #:
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09737673
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Filing Dt:
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12/15/2000
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Publication #:
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Pub Dt:
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06/20/2002
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Inventor:
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Chien-Ping Huang
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Title:
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METHOD OF ENCAPSULATING A SUBSTRATE-BASED PACKAGE ASSEMBLY WITHOUT CAUSING MOLD FLASH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TANTZU |
| NO. 123, SEC. 3, DA FONG ROAD |
| TAICHUNG, TAIWAN R.O.C |
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| EDWARDS & ANGELL, LLP |
| DIKE, BRONSTEIN, ROBERTS & CUSHMAN |
| PETER F. CORLESS-IP GROUP |
| 130 WATER STREET |
| BOSTON, MA 02109 |
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