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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/11/2003
Application #:
09844505
Filing Dt:
04/27/2001
Publication #:
Pub Dt:
02/21/2002
Inventors:
Roberto Zafarana, Antonino Scandurra, Salvatore Pignataro, Yuichi Tenya et al
Title:
POLYMERIC COMPOSITION FOR PACKAGING A SEMICONDUCTOR ELECTRONIC DEVICE AND PACKAGING OBTAINED THEREFROM
Assignment: 1
Reel/Frame:
012095/0424Recorded: 08/22/2001Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/25/2001
Exec Dt:
06/25/2001
Exec Dt:
06/25/2001
Exec Dt:
07/16/2001
Exec Dt:
07/16/2001
Assignees:
VIA C. OLIVETTI, 2
20041 AGRATE BRIANZA, ITALY
14-25, RYOKE 5-CHOME
KAWAGUCHI 332, JAPAN
Correspondent:
ALLEN, DYER, DOPPELT, MILBRATH, ET AL.
CHRISTOPHER F. REGAN, ESQ.
255 S. ORANGE AVE.
P.O. BOX 3791
ORLANDO, FLORIDA 32802
Assignment: 2
Reel/Frame:
024120/0925Recorded: 03/24/2010Pages: 2
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/03/2004
Assignee:
5-14-25, RYOKE, KAWAGUCHI
SAITAMA, JAPAN 332-8533
Correspondent:
CHRISTOPHER F. REGAN
255 S. ORANGE AVE., SUITE 1401
ORLANDO, FL 32801

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