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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/11/2003
Application #:
10302848
Filing Dt:
11/25/2002
Publication #:
Pub Dt:
04/17/2003
Inventors:
Noriyuki Takahashi, Seiichi Ichihara, Chuichi Miyazaki
Title:
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE BY MONOLITHICALLY FORMING A SEALING RESIN FOR SEALING A CHIP AND A REINFORCING FRAME BY TRANSFER MOLDING
Assignment: 1
Reel/Frame:
024755/0338Recorded: 07/29/2010Pages: 54
Conveyance:
MERGER AND CHANGE OF NAME
Assignor:
Exec Dt:
04/01/2010
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668
Correspondent:
MATTINGLY & MALUR, P.C.
1800 DIAGONAL RD.
SUITE 370
ALEXANDRIA, VA 22314

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