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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/11/2003
Application #:
10254799
Filing Dt:
09/26/2002
Inventors:
Ching-Yun Chu, Chyei-Jer Hsieh, Teng-Shao Su, Shun-Min Yeh
Title:
ETCHING BACK PROCESS TO IMPROVE TOPOGRAPHIC PLANARIZATION OF A POLYSILICON LAYER
Assignment: 1
Reel/Frame:
013334/0662Recorded: 09/26/2002Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/02/2002
Exec Dt:
09/02/2002
Exec Dt:
09/02/2002
Exec Dt:
09/02/2002
Assignee:
123, PARK AVE-3RD
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 30077, R.O.C.
Correspondent:
INTELLECTUAL PROPERTY SOLUTIONS, P.L.L.C
RAYMOND J. HO
1300 PENNSYLVANIA AVE., N.W.
STE. 700
WASHINGTON, DC 20004

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