Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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10172308
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Filing Dt:
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06/14/2002
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Publication #:
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Pub Dt:
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01/30/2003
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Inventors:
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Chien-Hsin Lai, Cheng-Chi Hsieh, Jung-Nan Tseng, Huang-Yi Lin, Fu-Yang Yu
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Title:
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WAFER PRESSURE REGULATION SYSTEM FOR POLISHING MACHINE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN RD. II, |
| HSINCHU, TAIWAN |
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| J.C. PATENTS, INC. |
| 4 VENTURE, |
| SUITE 250 |
| IRVINE, CA 92618 |
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