Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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10173213
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Filing Dt:
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06/14/2002
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Publication #:
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Pub Dt:
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08/07/2003
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Inventors:
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Eing-Chieh Chen, Shiu-Tai Tzung, Ting-Ke Chai, Jeng-Yuan Lai, Candy Tien
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Title:
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CAVITY-DOWN BALL GRID ARRAY PACKAGE WITH SEMICONDUCTOR CHIP SOLDER BALL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG RD., TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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| THE LAW OFFICES OF MIKIO ISHIMARU |
| MIKIO ISHIMARU |
| 1110 SUNNYVALE-SARATOGA RD. |
| SUITE A1 |
| SUNNYVALE, CA 94087 |
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