Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/25/2003
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Application #:
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10293532
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Filing Dt:
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11/12/2002
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Publication #:
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Pub Dt:
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10/23/2003
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Inventors:
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Yi-Sung Hwang, Sang-Woo Kim
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Title:
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SEMICONDUCTOR CHIP PACKAGE WITH DIRECTION-FLEXIBLE MOUNTABILITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SAN 16, BANWOI, RI, TAEAN-EUB, HWASUNG-CITY |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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MARGER JOHNSON & MCCOLLOM, P.C. |
ALAN T. MCCOLLOM |
1030 S.W. MORRISON STREET |
PORTLAND, OR 97205 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10F GOLDEN TOWER BLDG. |
511, SAMSEONG-RO, GANGNAM-GU |
SEOUL, KOREA, REPUBLIC OF |
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LEVENFELD PEARLSTEIN, LLC |
2 N. LASALLE STREET |
SUITE 1300 |
CHICAGO, IL 60602 |
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