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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/02/2003
Application #:
09831374
Filing Dt:
05/16/2001
Inventor:
Jun Kishimoto
Title:
MANUFACTURING PROCESS FOR SEMICONDUCTOR WAFER COMPRISING SURFACE GRINDING AND PLANARIZATION OR POLISHING
Assignment: 1
Reel/Frame:
011976/0972Recorded: 05/16/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/08/2001
Assignee:
4-2, MARUNOUCHI 1-CHOME
CHIYODA-KU, TOKYO, JAPAN
Correspondent:
ARENT FOX KINTNER PLOTKIN & KAHN PLLC
GEORGE E. ORAM, JR.
1050 CONNECTICUT AVENUE, N.W.
SUITE 600
WASHINGTON, D.C. 20036-5339

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