Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10053994
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Filing Dt:
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01/18/2002
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Inventors:
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Robert A. Newman, Jaime D. Weidler
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Title:
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SEMICONDUCTOR PACKAGING APPAATS FOR CONTROLLING DIE ATTACH FILLET HEIGHT TO REDUCE DIE SHEAR STRESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 3453 |
| ONE AMD PLACE, M/S 68 |
| SUNNYVALE, CALIFORNIA 94088 |
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| LARIVIERE, GRUBMAN & PAYNE, LLP |
| MAY LIN DEHAAN |
| P.O. BOX 3140 |
| MONTEREY, CA 93942-3140 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 40 PLEASANT STREET |
| SUITE 208 |
| PORTSMOUTH, NEW HAMPSHIRE 03801 |
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| CATHERINE XU |
| ONE FINANCIAL CENTER |
| MINTZ LEVIN |
| BOSTON, MA 02111 |
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