Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/23/2003
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Application #:
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09972796
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Filing Dt:
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10/06/2001
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Inventors:
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Charles W.C. Lin, Cheng-Lien Chiang
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Title:
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METHOD OF CONNECTING A BUMPED COMPLIANT CONDUCTIVE TRACE AND AN INSULATIVE BASE TO A SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PEITOU DISTRICT |
| 3RD FLOOR, 157 LI-TE ROAD |
| TAIPEI, TAIWAN 112 |
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| DAVID M. SIGMOND |
| 2440 ANDREW DRIVE |
| SUPERIOR, COLORADO 80027 |
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