Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/20/2004
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Application #:
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10328769
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Filing Dt:
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12/23/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Inventors:
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Jiunn-Ren Hwang, I-Hsiung Huang
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Title:
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METHOD OF FORMING OPENING IN WAFER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD. II |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| J. C. PATENTS, INC. |
| JIAWEI HUANG |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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