Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/17/2004
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Application #:
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10038262
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Filing Dt:
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01/03/2002
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Publication #:
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Pub Dt:
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07/11/2002
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Inventor:
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Tetsuro Toya
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Title:
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METHOD OF ADHERING WAFER AND WAFER ADHERING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1650, KIYONO, MATSUSHIRO-MACHI, NAGANO-SHI |
| NAGANO, 381-1233, JAPAN |
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| JORDAN AND HAMBURG LLP |
| C. BRUCE HAMBURG |
| CHANIN BUILDING, SUITE 4000 |
| 122 EAST 42ND STREET |
| NEW YORK, NY 10168 |
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