Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/17/2004
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Application #:
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09988575
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Filing Dt:
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11/20/2001
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Publication #:
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Pub Dt:
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10/17/2002
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Inventors:
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Kiyotaka Seyama, Hiroshi Yamada, Haruhiko Yamamoto
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Title:
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MULTICHIP MODULE HAVING CHIPS MOUNTED ON UPPER AND UNDER SURFACES OF A THIN FILM CLOSING AN OPENING FORMED IN A RIGID SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA, 4-CHOME NAKAHARA-KU KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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| STAAS & HALSEY LLP |
| H. J. STAAS |
| 700 ELEVENTH STREET, N.W., SUITE 500 |
| WASHINGTON, D.C. 20001 |
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