Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/24/2004
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Application #:
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09854006
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Filing Dt:
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05/10/2001
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Publication #:
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Pub Dt:
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10/24/2002
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Inventors:
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Shao-Chung Hu, Teng-Chun Tsai, Chia-Lin Hsu, Yung-Tsung Wei
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Title:
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POST-CMP REMOVAL OF SURFACE CONTAMINANTS FROM SILICON WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN RD. II |
| HSINCHU, TAIWAN R.O.C |
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| CHARLES C.H. WU & ASSOCIATES |
| CHARLES C.H. WU |
| 7700 IRVINE CENTER DRIVE, SUITE 710 |
| IRVINE, CA 92618-3043 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 400 COLLINS ROAD NE |
| M/S 124-323 |
| CEDAR RAPIDS, IOWA 52498 |
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| BLAKELY SOKOLOFF TAYLOR ET AL. |
| SHERYL SUE HOLLOWAY |
| 12400 WILSHIRE BOULEVARD |
| 7TH FLOOR |
| LOS ANGELES, CA 9025 |
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