Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10269677
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Filing Dt:
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10/11/2002
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Publication #:
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Pub Dt:
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06/12/2003
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Inventors:
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Nori Yoshihara, Akira Taniguchi
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Title:
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RESIN COMPOSITION FOR HIGH-FREQUENCY BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-8, DOJIMAHAMA 2-CHOME, KITA-KU |
| OSAKA-SHI, JAPAN |
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| LEYDIG, VOIT & MAYER, LTD. |
| JOHN KILYK |
| TWO PRUDENTIAL PLAZA |
| SUITE 4900 |
| CHICAGO, ILLINOIS 60601-6780 |
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