Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10185103
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Filing Dt:
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06/27/2002
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Publication #:
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Pub Dt:
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05/29/2003
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Inventors:
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Jong-Tae Moon, Yong-Sung Eom
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Title:
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OPTICAL MODULE PACKAGE OF FLIP CHIP BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| YUSONG-GU |
| 161, GAJEONG-DONG |
| DAEJON, KOREA, REPUBLIC OF |
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| BLAKELY, SOKOLOFF, TAYLOR ET AL. |
| GEORGE W HOOVER |
| 12400 WILSHIRE BOULEVARD |
| 7TH FLOOR |
| LOS ANGELES, CA 90025 |
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Assignment:
2
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ACKNOWLEDGEMENT OF PATENT EXCLUSIVE LICENSE AGREEMENT
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| 10TH FLOOR, GOLDEN TOWER, 511, SAMSUNG-RO, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF 135-090 |
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| H.C. PARK & ASSOCIATES, PLC |
| 1894 PRESTON WHITE DRIVE |
| RESTON, VA 20191 |
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