Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10142453
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Filing Dt:
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05/10/2002
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Publication #:
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Pub Dt:
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04/24/2003
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Inventors:
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Wen-Lung Cheng, Hung-Cheng Huang, I-Feng Chang
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Title:
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PACKAGE OF SEMICONDUCTOR CHIP WITH ARRAY-TYPE BONDING PADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SHINTAI 5TH RD. |
| 21 FL., NO. 88, SEC 1, |
| SHIJR CITY, TAIPEI, TAIWAN R.O.C |
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| LADAS & PARRY |
| RICHARD P. BERG |
| 5870 WILSHIRE BOULEVARD #2100 |
| LOS ANGELES, CA 90036-5679 |
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