Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/23/2004
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Application #:
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10262923
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Filing Dt:
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10/02/2002
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Inventors:
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Kuo-Chou Chen, Huai-jen Hsu
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Title:
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NOVEL ALUMINUM-COPPER BOND PAD DESIGN AND METHOD OF FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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121 PARK AVE. 3 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN R.O.C. |
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GEORGE O. SAILE |
28 DAVIS AVE. |
POUGHKEEPSIE, NY 12603 |
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