Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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03/30/2004
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Application #:
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10232729
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Filing Dt:
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09/03/2002
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Publication #:
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Pub Dt:
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03/04/2004
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Inventors:
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Chung-che Tsai, Wei-Heng Shan
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Title:
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STACKED CHIP PACKAGE WITH ENHANCED THERMAL CONDUCTIVITY
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO. 2, LI HSIN 3RD RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| BROWDY AND NEIMARK, P.L.L.C. |
| SHERIDAN NEIMARK |
| 624 NINTH STREET, N.W. |
| SUITE 300 |
| WASHINGTON, DC 20001-5303 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, LI-HSIN RD. 3 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN CHU, TAIWAN R.O.C. |
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| BROWDY AND NEIMARK, P.L.L.C. |
| NORMAN J. LATKER |
| 624 NINTH STREET, N.W. |
| SUITE 300 |
| WASHINGTON, DC 20001-5303 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO.2 LI-HSIN ROAD 3, SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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