Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/06/2004
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Application #:
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09996802
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Filing Dt:
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11/30/2001
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Publication #:
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Pub Dt:
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08/08/2002
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Inventors:
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Tetsuro Sato, Tsutomu Asai
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Title:
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RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIRING BOARD, RESIN SHEET AND RESIN APPLIED-COPPER FOIL FOR FORMING INSULATING LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU, |
| TOKYO 141-8584, JAPAN |
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| ARENT FOX KINTNER PLOTKIN & KAHN PLLC |
| ROBERT B. MURRAY |
| 1050 CONNECTICUT AVENUE, N.W., SUITE 400 |
| WASHINGTON D.C. 20036-5339 |
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