Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/11/2004
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Application #:
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10361717
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Filing Dt:
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02/10/2003
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Inventors:
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Yi Pan, Brazel G. Preece
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Title:
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METHOD FOR LAPPING A WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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POST OFFICE BOX 8965, M/S 50-2-870 |
VANCOUVER, WASHINGTON 98668-8965 |
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ALSTON & BIRD LLP |
GUY R. GOSNELL |
BANK OF AMERICA PLAZA |
101 SOUTH TRYON STREET, SUITE 4000 |
CHARLOTTE, NC 28280-4000 |
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