Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/08/2004
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Application #:
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09648777
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Filing Dt:
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08/28/2000
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Inventors:
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Song-Hua Shi, Ching-Ping Wong
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Title:
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PROCESS AND MATERIAL FOR LOW-COST FLIP-CHIP SOLDER INTERCONNECT STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 400 TENTH STREET, N.E. |
| ATLANTA, GEORGIA 30332 |
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| TROUTMAN SANDERS LLP |
| TODD DEVEAU |
| 600 PEACHTREE STREET, N.E. |
| SUITE 5200 |
| ATLANTA, GA 30308-2216 |
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