Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/08/2004
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Application #:
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09906303
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Filing Dt:
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07/16/2001
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Publication #:
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Pub Dt:
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04/25/2002
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Inventors:
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Seong-ho Liu, Kyung-tae Lee
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Title:
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BOND PAD OF SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416, MAETAN-DONG, PALDAL-GU |
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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MILLS & ONELLO LLP |
STEVEN M. MILLS |
ELEVEN BEACON STREET, SUITE 605 |
BOSTON, MA 02108 |
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