Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/22/2004
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Application #:
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10604838
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Filing Dt:
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08/21/2003
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Inventor:
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Chung W. Ho
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Title:
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[STRUCTURE OF A SUBSTRATE FOR A HIGH DENSITY SEMICONDUCTOR PACKAGE]
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, KUAN-FU N. RD., HSINCHU INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, TAIWAN 100 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, KUANG-FU N. RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, TAIWAN 100 |
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