Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/13/2004
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Application #:
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10122898
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Filing Dt:
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04/11/2002
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Publication #:
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Pub Dt:
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10/16/2003
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Inventors:
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Shao-Chang Huang, Jin-Tau Chou
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Title:
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CIRCUIT STRUCTURE FOR CONNECTING BONDING PAD AND ESD PROTECTION CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN RD. II |
| HSINCHU, TAIWAN R.O.C |
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| J.C. PATENTS, INC. |
| JIAWEI HUANG |
| 4 VENTURE, SUITE 250 |
| IRVINE, CALIFORNIA 92618 |
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