Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/20/2004
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Application #:
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10188284
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Filing Dt:
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07/01/2002
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Publication #:
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Pub Dt:
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01/30/2003
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Inventors:
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Tan Kek Yong, Lee Boon Seng
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Title:
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TEST HANDLER APPARATUS FOR SMD (SURFACE MOUNT DEVICES), BGA (BALL GRID ARRAYS) AND CSP (CHIP SCALE PACKAGES)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TANJONG AGAS INDUSTRIAL AREA, P.O. BOX 28 |
| 8400 MUAR, JOHORE, MALAYSIA |
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| SEED INTELLECTUAL PROPERTY LAW GROUP |
| ROBERT IANNUCCI |
| 701 FIFTH AVENUE, SUITE 6300 |
| SEATTLE, WA 98104-7092 |
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